Example: air traffic controller
Wafer Level Chip Size
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cdn.sparkfun.comOV05647-G04A (color, chip probing, 200 µm backgrinding, reconstructed wafer) 00applications cellular phones toys PC multimedia digital still cameras 00features 1.4 µm x 1.4 µm pixel with OmniBSI technology for high performance (high sensitivity, low crosstalk, low noise) optical size of 1/4" automatic image control functions: automatic
TECHNOLOGY SOLUTIONS Flip Chip Packaging
c44f5d406df450f4a66b-1b94a87d576253d9446df0a9ca62e142.ssl.cf2.rackcdn.comrequirements, different package level solutions are required. Thus flip chip interconnect can be used in a wide range of package solutions, each focused on specific benefits that serve a given market. Amkor offers the widest possible range of flip chip packaging solutions to meet the diverse needs of customers and end users.