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Advanced Packaging Current Trends & Challenges

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2020From Technologies to MarketsAdvanced Packaging Current Trends & Challenges9ADVANCED Packaging PLATFORMS Classification at System Integration LevelWafer levelSubstrate/Strip level (Panel based)Panel levelLevel 1 -DieInterconnectionSubstrate/ leadframeLevel 2 - Packaging ModuleLevel 3 -No SMT neededSiP/PoP, in PCB/FlexED in laminateOrganic/glass substrate organic substrateFlip-chipWire-bondRDLFIWLPFOWLP 3 glass bridgeBump/pillarTSV/ TGVCeramic/ leadframe and othersAdvanced organic substrateMold embeddingOrganic interposerFCWBCSPBGA StandardBGA AdvancedLGABGALGACSPOrganic substrateCeramic/ leadframe and othersFCWBAP platform10 2018 | | Status of the Advanced Packaging Industry 2018ADVANCED Packaging MARKET SHARE EVOLUTION 2014-2025Advanced Packaging rev

FIWLP FOWLP 3D/2.5D FOPLP Silicon/ glass bridge Bump/ pillar TSV/ TGV Ceramic/ leadframe and others Advanced organic substrate Mold embedding Organic interposer FC WB CSP BGA Standard BGA Advanced LGA BGA LGA CSP Organic substrate Ceramic/ leadframe and others ... TECHNOLOGY ROADMAP: FROM NANO-SCALE TO MICRO-SCALE.. 2015 2017 2019 …

  Technology, Advanced, Organic, Interposer, Advanced organic, Organic interposer

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