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IPC/JEDEC-9704Printed Wiring BoardStrain Gage Test GuidelineDeveloped by the JEDEC Reliability Test Methods for Packaged DevicesCommittee ( ) and the SMT Attachment Reliability Test MethodsTask Group (6-10d) of the Product Reliability Committee (6-10) of IPCUsers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309SBannockburn, Illinois60015-1219Tel 847 847 CONNECTINGELECTRONICS INDUSTRIES Table of ........................................ ........................... and Definitions ........................................ .... 22APPLICABLE ........................................ ................................. ........................................ ............................ Publications ........................................ ......... 23GENERAL.
Printed Wiring Board Strain Gage Test Guideline 1 SCOPE This document describes specific guidelines for strain gage testing for Printed Wiring Board (PWB) assemblies in …
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