ASSOCIATION CONNECTING ELECTRONICS …
IPC/JEDEC-9704Printed Wiring BoardStrain Gage Test GuidelineDeveloped by the JEDEC Reliability Test Methods for Packaged DevicesCommittee ( ) and the SMT Attachment Reliability Test MethodsTask Group (6-10d) of the Product Reliability Committee (6-10) of IPCUsers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309SBannockburn, Illinois60015-1219Tel 847 847 CONNECTINGELECTRONICS INDUSTRIES Table of ........................................ ........................... and Definitions ........................................ .... 22APPLICABLE ........................................ ................................. ........................................ ............................ Publications ........................................ ......... 23GENERAL ........................................ ............................. and Gage.
Printed Wiring Board Strain Gage Test Guideline 1 SCOPE This document describes specific guidelines for strain gage testing for Printed Wiring Board (PWB) assemblies in the
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