“Closed Loop” Study for Wire Bonding Process
1 closed Loop Study for wire Bonding ProcessJeremy KOH, GOH Kay S oon, Winston BAUTIS TA & Jimmy CAS TANEDASPT Asia Pte Ltd, 970 Toa Pay oh, #07-25/26, Sin gap ore :P resent ly, in st andard and some fine pit ch wirebonding applicat ions, the met hods forchecking the bond qualit y during volumeproduct ion st ill remains t he same. Theinspect ion met hods used t o det ermine thequalit y of t he bonds have proven t o beaccept able and reliable for many currentindust rial needs are ball shearing, measuringt he ball diamet er and wire pull measurement .These methods are accept able, but as thesemiconductor sector moves t owards ult ra finepitch wire Bonding , dat a obt ained by t heseconvent ional met hods may not be sufficient.
1 “Closed Loop” Study for Wire Bonding Process Jeremy KOH, GOH Kay Soon, Winston BAUTISTA & Jimmy CASTANEDA SPT Asia Pte Ltd, 970 Toa Payoh, #07-25/26, Singapore 318992.
Download “Closed Loop” Study for Wire Bonding Process
Information
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document: