Device Reliability Report First Half 2021
Device Reliability ReportFirst Half 2021UG116 ( ) November 10, 2021Xilinx is creating an environment where employees, customers, andpartners feel welcome and included. To that end, we re removing non-inclusive language from our products and related collateral. We velaunched an internal initiative to remove language that could excludepeople or reinforce historical biases, including terms embedded in oursoftware and IPs. You may still find examples of non-inclusivelanguage in our older products as we work to make these changes andalign with evolving industry standards. Follow this link for HistoryThe following table shows the revision history for this Version 1: The Reliability ProgramIn Table 7, added 7 nm and removed 130 nm processtechnology.
and packages: XCE06L24T, XC17SxxxA, XC17Vxxx, XCE0104, XC9572XL (PCG44 only), and PG120. Chapter 1: The Reliability Program Changed the title of Table 8 to ESD and Latch-up Data for PROMs, CPLDs, and Older FPGAs. Added devices to Table 15. Changed nomenclature for degrees Kelvin to K. Updated Table 18. Updated Table 19 and Table 20 data for the ...
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