Electronic Packaging Technologies - Carleton University
Electronic Packaging Technologies1Electronic Packaging Electronic Packaging TechnologiesTechnologiesSergio Lopez-Buedo, Eduardo BoemoUniversidad Autonoma de Madride-mail: Packaging Technologies2Introduction to Electronic PackagingIntroduction to Electronic Packaging Electronic Packaging is a multi-disciplinary subject Mechanical, Electrical and Industrial Engineering, Chemistry, Physics and even Marketing Electronic Packaging :Housing and interconnection of integrated circuits to form Electronic systems Electronic Packagingmust provide Circuit support and protection Heat dissipation Signal distribution Manufacturability and serviceability Power distributionElectronic Packaging Technologies3Issues in Electronic PackagingIssues in Electronic PackagingMechanical analysis and testingReliability, performance, cost, market need/timing, manufacturability, analysis and testingElectrical analysis and testingChemistry,Physics, Mat.
mapping method to pick up only good die. For most processes, die attach materials like gold or lead-tin based solder wires or silver epoxy paste potting on the frame are required prior to die bonding process. ... Package Substrate • The die attachment compound should provide
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