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ELECTRONICS INDUSTRIES Monotonic Bend …

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IPC/JEDEC-9702Monotonic BendCharacterizationof board -LevelInterconnectsDeveloped by the SMT Attachment Reliability Test Methods Task Group(6-10d) of the Product Reliability Committee (6-10) of IPC and theJEDEC Reliability Test Methods for Packaged Devices Committee( )Users of this publication are encouraged to participate in thedevelopment of future :IPC2215 Sanders RoadNorthbrook, Illinois60062-6135Tel 847 847 State Technology Association2500 Wilson BoulevardArlington, VA 22201-3834Tel 703 703 CONNECTINGELECTRONICS INDUSTRIES Table of 14TERMS AND 15SYMBOLS AND ABBREVIATED Tester ........................................ ............... Measurement Equipment .............................. Monitoring Equipment.

Monotonic Bend Characterization of Board-Level Interconnects 1 FOREWORD This publication on monotonic bend testing is intended to characterize the fracture strength of a component’s board-

  Testing, Levels, Board, Characterization, Interconnect, Monotonic, Bend, Monotonic bend characterization of board level interconnects, Bend testing

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