ELECTRONICS INDUSTRIES Performance Test Methods and ... …
IPC-9701APerformance TestMethods and QualificationRequirements for SurfaceMount Solder AttachmentsDeveloped by the SMT Attachment Reliability Test Methods Task Group(6-10d) of the Product and Reliability Committee (6-10) of IPCUsers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309SBannockburn, Illinois60015-1219Tel 847 847 :IPC-9701 - January 2002ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES Table of ........................................ ........................ Classification ................................. of Terms ........................................ .... 12APPLICABLE ........................................ .............................. Industry Standards ..................................... Tin Research Institute ................... Publications.
Requirements for Surface Mount Solder Attachments 1 SCOPE This specification establishes specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. It further establishes different levels of performance and reliability of the solder attachments of surface mount devices to rigid,
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