IPC-TM-650 TEST METHODS MANUAL
1 ScopeThis test method provides a means to assess the propen-sity for conductive anodic filament (CAF) growth, a form ofelectrochemical migration, and similar conductive filament for-mation (CFF) laminate material failure modes within a printedwiring board (PWB). Conductive anodic filaments may becomposed of conductive salts, rather than cationic metal ions,however inadequate dielectric for the applied voltage, compo-nent failures, and part use exceeding the maximum operatingtemperature (MOT) of the laminate can contribute to productfailures as well. This test method can be used to assess PWBlaminate materials, PWB design and application parameters,PWB manufacturing process changes and press-fit Applicable IPCIPC-9253CAF Test Board Design (Available in the Drafts section of the 5-32e Task group Home Page)IPC-9254CAF Test Board Design (Available in the Drafts section of the 5-32e Task group Home Page)IPC-9255CAF Test Board Design (Available in Free Down-loads in IPC Home Page)IPC-9256CAF Test Board Design (Available in Free Down-loads in IPC Home Page)IPC-9691CAF Test Method User Guide for the IPC-TM-650 ,Method J-STD-001Requirements for Soldered Electrical andElectronic AssembliesIPC J-STD-004Requirements for Soldering FluxesIPC J-STD-006Requirements for Electronic Grade SolderAlloys and Fluxed and Non-Fluxed Solid Solders for Elect
IPC-TM-650 TEST METHODS MANUAL Number 2.6.25 Subject Conductive Anodic Filament (CAF) Resistance Test: X-Y Axis Date 04/16 Revision B Originating Task Group Electrochemical Migration Task Group (5-32e) Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only
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