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Full Terms & Conditions of access and use can be found by: [ ]Date: 01 June 2017, At: 08:26International materials ReviewsISSN: 0950-6608 (Print) 1743-2804 (Online) Journal homepage: and future thermal interface materials forelectronic devicesKafil M. Razeeb, Eric Dalton, Graham Lawerence William Cross & AnthonyJames RobinsonTo cite this article: Kafil M. Razeeb, Eric Dalton, Graham Lawerence William Cross & AnthonyJames Robinson (2017): Present and future thermal interface materials for electronic devices ,International materials Reviews, DOI: link to this article: online: 27 Mar your article to this journal Article views: 93View related articles View Crossmark dataPresent and future thermal interface materials for electronic devicesKafil M. Razeeba, Eric Daltonb, Graham Lawerence William Crosscand Anthony James Robinsond,eaTyndall National Institute, University College Cork, Cork, Ireland;bStokes Laboratories, University of Limerick, Limerick, Ireland;cSchool ofPhysics, CRANN Nanotechnology Institute, Trinity College Dublin, Dublin 2, Ireland;dDepartment of Mechanical & ManufacturingEngineering, Trinity College Dublin, Dublin 2, Ireland;eCONNECT, Dunlop Oriel House, Trinity College, Dublin, IrelandABSTRACTPackaging electronic devices is a growing challenge as device performance and power levelsescalate.

Present and future thermal interface materials for electronic devices Kafil M. Razeeb a, Eric Daltonb, Graham Lawerence William Crossc and Anthony James Robinsond,e aTyndall National Institute, University College Cork, Cork, Ireland; bStokes Laboratories, University of Limerick, Limerick, Ireland; cSchool of

  Devices, Thermal, Material, Electronic, Interface, Thermal interface materials for electronic devices