Semiconductor Manufacturing Equipment

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SemiconductorManufacturingEquipmentUSITC Publication 3868June 2006OFFICE OF International Trade CommissionWashington, DC 20436UNITED STATES INTERNATIONAL TRADE COMMISSIONThis report was prepared principally byHeather Sykes and Falan Yinugunder the direction ofMichael Anderson,Chief, Advanced Technology and Machinery DivisionRobert Carr,Chief, Natural Resources and Metals DivisionAddress all communications toSecretary to the CommissionUnited States International Trade CommissionWashington, DC 20436COMMISSIONERSShara L. Aranoff, Vice ChairmanDaniel R. Pearson, ChairmanJennifer A. HillmanStephen KoplanDeanna Tanner OkunCharlotte R. A. RogowskyDirector of OperationsKaren Laney-CummingsDirector of Industries 1 The information and analysis provided in this report are for the purpose of this report in this report should be construed to indicate how the Commission would find in aninvestigation conducted under statutory authority covering the same or similar subject 1991, the United States International Trade Commission initiated its current Industry andTrade Summary series of informational reports on the thousands of products imported intoand

saws, and grinding and polishing equipment that produce the finished silicon wafers. Wafer processing equipment This equipment is used to make the electronic circuit pathways by placing conductive and nonconductive materials on the silicon wafer. The pl acement is achieved by bombarding t he wafer with elements or by adding layers of material.

  Grinding