SOT23 - NXP
SOT23plastic, surface-mounted package; 3 terminals; mm pitch; mm x mm x 1 mm body9 January 2017Package information1. Package summaryDimensions (mm) x x 1Terminal position codeD (double)Package type descriptive codeTO-236ABPackage outline version codeSOT23Manufacturer package codeSOT23Package type industry codeTO-236ABPackage outline version descriptionplastic, surface-mounted package; 3 terminals; mm pitch; mm x mm x 1 mm bodyPackage style descriptive codeSOT (small outline transistor)Package body material typePJEDEC package outline codeTO-236ABHandling precautionsIC26_CHAPTER_3_2000Thermal design considerationsSC18_1999_CHAPTER_5_2Mount ing method typeS (surface mount)Generic mounting and soldering informationAN10365_3Reflow sol
Package outline version description plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body Package style descriptive code SOT (small outline transistor) Package body material type P JEDEC package outline code TO-236AB Handling precautions IC26_CHAPTER_3_2000 Thermal design considerations …
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