Surface Mount Placement Equipment Characterization
IPC-9850ASurface MountPlacement EquipmentCharacterizationDeveloped by the SMT Component Placement EquipmentSubcommittee (5-41) of the Assembly Equipment Committee(5-40) of IPCUsers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309SBannockburn, Illinois60015-1249Tel 847 847 :IPC-9850 - July 2002 Table of Contents1 ........................................ ............................ ........................................ ...................... Future ........................................ ............... Characterization Limitations ................................... Binding Requirements ........................................ ..... Test Components ........................................ ............. Test Panels ........................................ ....................... Methods.
Surface Mount Placement Equipment Characterization 1 INTRODUCTION 1.1 Scope This standard establishes the procedures to characterize the capability of surface mount assembly equipment in specification documents, as well as in documentation used to verify a specific machine’s placement capability and confor-
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