Technical Data Sheet - Rikei

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Technical data SheetFor reference OnlyHigh Temperature EpoxyDate:Feb 2014Recommended Cure:150 C / 1 HourRev:XXVIIITwoFrozen SyringeMinimum Alternative Cure(s): 10 : C / 1 MinutePart C / 5 Minutes 3 Hours2 Hours100 C /10 MinutesOne year at 23 CSix months at -40 C80 C /30 MinutesPHYSCIAL PROPERTIES:*Color (before cure):Part A: Clear (Gardner <5) Part B: Amber (Gardner <18)*ConsistencyPourable liquid*Viscosity (23 C): @ 50 rpm3,000 - 5,000cPsThixotropic Index:N/A*Glass Transition Temp: 90 C (Dynamic Cure:20-200 C/ISO 25 Min; Ramp -10-200 C @ 20 C/Min)Coefficient of Thermal Expansion (CTE): Below Tg:54x 10-6 in/in C Above Tg:206x 10-6 in/in CShore D Hardness:85Lap Shear @ 23 C:> 2,000psiDie Shear @ 23 C: 15Kg 5,100psiDegradation Temp:412 CWeight Loss: @ 200 @ 250 @ 300 :: Continuous:- 55 C to 250 C Intermittent:- 55 C to 350 CStorage Modulus:516,912psiIon Content:Cl:329ppm NH4+:409ppm K+: 5ppm*Particle Size:N/AELECTRICAL AND THERMAL PROPERTIES:Thermal Conductivity:N/AVolume Resistivity @ 23 C: x 1013Ohm-cmDielectric Constant (1KHz) Factor (1KHz) PROPERTIES @ 23 C:Spectral Transmission: 50% @ 550 nm 98% @ 800 - 1,000 nm 95% @ 1,100 - 1,600 nmIndex of Refraction (uncured) @ 589 nmShel

Technical Data Sheet For Reference Only High Temperature Epoxy EPO-TEK® 353ND EPO-TEK® 353ND Advantages & Suggested Application Notes: Hybrid suggested applications: providing near hermetic seals and UHV seals in sensor devices,

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