MEPTEC 2017 SEMICONDUCTOR PACKAGING …

A Quarterly Publication of The Microelectronics Packaging & Test Engineering Council Volume 21, Number 3 FALL 2017 MEPTEC Report Vol. 21, No. 3. Published quarterly by MEPCOM LLC, 315 Savannah River Dr., Summerville, SC 29485.

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The 8 Disciplines Problem Solving Process - …

© 2008 - 2011 1 The 8 Disciplines Problem Solving Process Application to a Medical Device Arthur Jonath, PhD & Fred Khorasani, PhD www.jonathassociates.com

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Compact Antenna for Medical Wireless …

Compact Antenna for Medical Wireless Communications Applications Vishay Intertechnology Patrick Gormally Applications Engineer & Product Manager

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SEMICONDUCTOR PACKAGING ROADMAP …

SEMICONDUCTOR PACKAGING ROADMAP SYMPOSIUM MEPTEC INITIATES COLLABORATION ... Promex provides mixed technology assembly processes that integrate conventional surface mount technology ... of outsourced semiconductor packaging, design, assembly and test services; Amkor helps make “next generation” …

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Silver Sintering for Power Electronics - MEPTEC.ORG

3 October 23, 2014 Low temperature sintering die attach for Power Electronics Power Electronics Material Development Focus Technology Trends

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Wireless Sensors and Energy Harvesting in Helathcare

Implanted Medical Telemetry ... –Preventative diagnostics –Shorten surgery time, eliminate some Insulin pump surgical procedures Enable new wireless applications and therapies to improve ... Wireless Monitoring is a Key Element of the Transition

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Die Attach Film

Die Attach Film INNOSEM WL Series January. 2012 R&D Center-PKG materials 1team -

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1. Initial Precautions 2. Technical Precautions and ...

1 How to apply Arctic Silver Premium Thermal Adhesive 1. Initial Precautions 2. Technical Precautions and Suggestions 3. General Information and Cure Stages

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August-2010 - Bonding Source

TDS ABLEBOND JM7000, August-2010 Note The data contained herein are furnished for information only and are believed to be reliable. We cannot assume

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Cree EZBright LED Handling and Packaging …

Cree® EZ-n™ (Gen 2) LED Chips Handling and Packaging Recommendations INTRODUCTION This application note provides the user with an understanding of Cree’s EZ-n™ n-pad up (cathode up) LED

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Compact Camera Modules - LOCTITE

Compact Camera Modules | 3 Camera Module Assembly Die Attach Electrically Conductive Adhesives House / IR Filter / Lens Bonding Adhesives Underfill

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How Plasma-Enhanced Surface Modification …

ubstrate materials and the adhe-sives employed for attachment often do not possess the needed physical or chemical properties to allow for good

Die Attach Film Performance in 3D QFN Stacked Die

Die Attach Film Performance in 3D QFN Stacked Die. A. JALAR, M. F. ROSLE, M. A. A. HAMID. School of AppliedPhysics, Faculty of Science and Technology

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