PURCHASE ORDER TERMS AND CONDITIONS - Astellas

Each package or container shall be marked clearly to show this Purchase Order number, ship date, and ... samples, models, descriptions, instructions, and other items referred to in this Purchase Order. Seller also warrants that the goods or services to be delivered ... remain the property of Buyer, (b) be carefully preserved and ...

  Property, Descriptions, Packages

Xilinx UG112 Device Package User Guide

Device Package User Guide www.xilinx.com UG112 (v3.7) September 5, 2012 03/17/09 3.2 Revised “Small Form Factor Packages,” page 15 to include description of third template used for marking small form factor packages. Revised “Package Construction,” page 20 to describe flip-chip package vent hole locations.

  Packages, Xilinx

Land Grid Array (LGA) Socket and Package Technology

LGA package land pads from scratches and contamination when handled with vacuum wand or by hand. LGA Package in Thermoformed Tray. Land Side Cover. Avoid touching. gold pads! Note: LGA packages dropped with or without the land side cover should be scrapped. Tab. Substrate. Stepped. IHS. Orientation. Notch. Capacitors. Gold Pads

  Packages

LGA1150 Socket — Application Guide - Intel

performance using total package power. Defined as (TCASE – TS) / Total Package Power. Ψ sa Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power. Defined as (TS – TLA) / Total Package Power. SMD The Solder Mask Defined pad is typically a pad in a flood plane where the solder ...

  Guide, Intel, Applications, Sockets, Packages, Lga1150 socket application guide, Lga1150

Future Technology Devices International Ltd

Part Number Package FT232HL -xxxx 48 Pin LQFP FT232HQ-xxxx 48 Pin QFN Note: Packaging codes for xxxx is: Reel: Taped and Reel (LQFP = 1500 pieces per reel, QFN = 3000 pieces per reel) Tray: Tray packing, (LQFP = 250 pieces per tray, QFN =260 per tray) Please refer to section 8 for all package mechanical parameters. 1.3 USB Compliant

  Packages

Ultralow Noise, 200 mA, CMOS Linear Regulator Data Sheet ...

Data Sheet ADP151 Rev. I | Page 3 of 23 SPECIFICATIONS V IN = (V OUT + 0.4 V) or 2.2 V, whichever is greater, EN = V IN, I OUT = 10 mA, C IN = C OUT = 1 μF, and T A = 25°C, unless otherwise noted. Note that V IN is the input voltage, V OUT is the output voltage, I OUT is the output current, C IN is the input capacitance, and C OUT is the output capacitance. Table 1. ...

ADG1408/ADG1409 (Rev. D) - Analog Devices

Data Sheet ADG1408/ADG1409 Rev. D | Page 5 of 19 12 V SINGLE SUPPLY V DD = 12 V ± 10%, V SS = 0 V, GND = 0 V, unless otherwise noted. Table 3. Parameter +25°C −40°C to +85°C −40°C to +125°C1 Unit Test Conditions/Comments ANALOG SWITCH

  Devices, Analog devices, Analog