Transcription of 2021 IEEE IEEE SOLID-STATE CIRCUITS SOCIETY
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ADVANCE PROGRAM2021 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE FEBRUARY 13, 14, 15, 16, 17, 18, 19, 20, 21, 22 CONFERENCE THEME: INTEGRATED INTELLIGENCE IS THE FUTURE OF SYSTEMSNEW THIS YEAR! Going VirtualIEEE SOLID-STATE CIRCUITS SOCIETYDRAFT 2 - 6 - 202112 tutorials : RF & mm-Wave PAs; Memory Subsystem for HPC/AI; Silicon Photonics; Measuring/Evaluating Security Level CIRCUITS ; Calibration Technologies in ADCs; DAC-Based WLn Transmitters; Design Accelerating DNNs; On-Chip Interconnects; Design Amplifier Stability; Fully Integrated Voltage Regulators; Ultra-Low-Power Receiver; Brain Computer Interfaces6 FORUMS: Energy Efficiency & Flexibility of ML Processors; Accuracy for DC & Analog CIRCUITS ; Silicon in the Fight Against Pandemics; Electronics for a Quantum World; System Architectures for ; Optical/Electrical TransceiversSHORT COURSE: circuit Design in Advanced CMOSISSCC VISION STATEMENT The International SOLID-STATE CIRCUITS Conference is the foremost global forum for presentation of advances in SOLID-STATE CIRCUITS and systems-on-a-chip.
the tutorial introduces PA performance metrics and their impact on wireless systems. Next, it presents the design basics of bot h PA active circuits and passive networks. The tutorial discusses popular PA classes, such as Class A, AB, B/C, E, F/F-1, and J. Finally, the tutorial concludes with several RF and mm-wave PA design examples.
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