Transcription of Advanced Packaging Current Trends & Challenges
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Advanced Packaging Current Trends & Challenges
2020 From Technologies to MarketsAdvanced Packaging Current Trends & Challenges9 Advanced Packaging PLATFORMS Classification at System Integration LevelWafer levelSubstrate/Strip level (Panel based)Panel levelLevel 1 -DieInterconnectionSubstrate/ leadframeLevel 2 - Packaging ModuleLevel 3 -No SMT neededSiP/PoP, in PCB/FlexED in laminateOrganic/glass substrate organic substrateFlip-chipWire-bondRDLFIWLPFOWLP 3 glass bridgeBump/pillarTSV/ TGVC eramic/ leadframe and othersAdvanced organic substrateMold embeddingOrganic interposerFCWBCSPBGA StandardBGA AdvancedLGABGALGACSPO rganic substrateCeramic/ leadframe and othersFCWBAP platform10 2018 | | Status of the Advanced Packaging Industry 2018 Advanced Packaging MARKET SHARE EVOLUTION 2014-2025 Advanced Packaging revenue will almost equal to traditional Packaging revenue by 2019.
ADVANCED PACKAGING REVENUE FORECAST 2019-2025 • NOTE: • Values represent packaging services (assembly and test) and do not include FEOL Si die processing • TSV* includes portion of package revenue not included in Flip-chip or fan-in • The Advanced Packaging market was worth ~$28.8B in 2019. It is expected to grow at ~ 7% CAGR
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