Transcription of Advanced Packaging Current Trends & Challenges
{{id}} {{{paragraph}}}
2020 From Technologies to MarketsAdvanced Packaging Current Trends & Challenges9 Advanced Packaging PLATFORMS Classification at System Integration LevelWafer levelSubstrate/Strip level (Panel based)Panel levelLevel 1 -DieInterconnectionSubstrate/ leadframeLevel 2 - Packaging ModuleLevel 3 -No SMT neededSiP/PoP, in PCB/FlexED in laminateOrganic/glass substrate organic substrateFlip-chipWire-bondRDLFIWLPFOWLP 3 glass bridgeBump/pillarTSV/ TGVC eramic/ leadframe and othersAdvanced organic substrateMold embeddingOrganic interposerFCWBCSPBGA StandardBGA AdvancedLGABGALGACSPO rganic substrateCeramic/ leadframe and othersFCWBAP platform10 2018 | | Status of the Advanced Packaging Industry 2018 Advanced Packaging MARKET SHARE EVOLUTION 2014-2025 Advanced Packaging revenue will almost equal to traditional Packaging revenue by 2019, the AP market share was Due to strong momentum in AP market driven by mega Trends .
Hana Micron (Rev w/o Hana Materials) Greatek Elec AOI Electronics Carsem Sigurd Microelectronics Formosa Advanced Technologies Nepes Corporation Unisem Berhad Ardentec Inari Amertron Berhad Tong Hsing Walton Advanced Engineering ... Sub-systems Design & Assembly Design of chip & package
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
{{id}} {{{paragraph}}}