Transcription of Agilent 5DX Series 3 - AXIAOI
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Agilent 5DX Series 3 - AXIAOI
Key SpecificationsSystem Application The Agilent 5DX Series 3 is designed for In-line AutomatedProcess Testing of solder connections on PCB assemblies,with pass-thru or pass-back loading. The system can be usedfor all standard joint-types and fully supports inspection ofsingle and double-sided boards having dimensions up to 457x 609 mm (18 x24 in.).Test Approach Digital cross-sectional X-ray images of solder joints are automatically generated and analyzed. The analysis resultsincludes a complete quantitative description of each joint, aswell as a list of all defective solder connections confirmation and adjustment routines provide solderthickness of key solder joint Thickness Measurement RepeatabilitySolder thickness from to mm ( to in.) canbe measured with a repeatability standard deviation of lessthan 4% for all component types except capacitors andthrough-hole.
Key Specifications System Application The Agilent 5DX Series 3 is designed for In-line Automated Process Testing of solder connections on PCB assemblies,
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