Transcription of aluminium etching - MicroChemicals
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aluminium etching - MicroChemicals
AluminiumEtchingRevised: 2013-11-07 , wafers, plating solutions, etchants and solvents ..Phone: +49 731 977343 0 chemicals concentrations mentioned in this chapter with a * refer to a conventional concen-tration listed in the last section of this has a density of g/cm3 and thereforebelongs to the light metals. Its crystal structure is cu-bic face to its high electric conductivity, aluminium is usedfor conductors in microelectronics where it is often al-loyed with copper in order to prevent electro migra-tion, or with silicon in order to prevent the formationof (silicon-consuming) aluminium -silicon a standard potential of V, aluminium doesnot belong to the noble metals.
Aluminium etching is highly exothermic, an (inevitable, since isotropic etching) underetching of the resist mask causes local heating (increased etch rate) and super-proportional under-etching of the mask as a consequence, if no agitation is performed. Strong H 2-bubbling reduces etch homogeneity. Improvements of the etch rate homogeneity
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