Transcription of An Industrialization program for DPPM reduction - …
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1An Industrialization program for DPPM reductionA joint presentation of STMicroelectronics and Test advantageIntroduction: An automotive grade program deployment schemeMay 20062 Introduction Defects do exists. Defects are embedded in the physical properties of materials and potential defectivity in equipments, designs, test programs and test failure is achieved by the means of defects reduction activity and robustness validation, detection, screening. By reducing the defectivity By developing robust electronics and applications to failure modes By applying Failure mode driven stress and screening to remove weak parts By effective detection of defects or weak parts before reaching the customer. This presentation describe an Industrial program aimed to implement PAT (Parts Average Testing) at Electrical wafer Sort.
1 An Industrialization program for DPPM reduction A joint presentation of STMicroelectronics and Test advantage Introduction: An automotive grade program deployment scheme
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Wafer prober_full auto accretech uf3000, Testing, Prober, Microscope Units, Microscope Units Microscope units, ASSOCIATION CONNECTING ELECTRONICS, AUTOMATIC VISUAL INSPECTION) for Probe, AUTOMATIC VISUAL INSPECTION) for Probe Mark Inspection, V Electrical Measurements, V Electrical Measurements Using the Zyvex