ASE Technology Roadmap - asetwn.com.tw

ASE Technology RoadmapASE Technology RoadmapPresented by The Advanced Semiconductor Engineering GroupDec. 01. 2006 ASEK 2007 Roadmap PKG Roadmap update. SIP / PiP / POP Technology Roadmap Leadless QFN Technology Roadmap Low K / Fine Pitch Wire Bond Technology Technology Overview -- SiPPackage ItemAvailable200720082009 Package Thickness (mm)(2/3/4 die stacked) / / / / / / / of Die99 Hybrid (WB+FC) Package Height (mm) ~20X2010X10~20X20 Max. Package Size (mm)27x2721x21 Wire Bond TechnologyTri-tierTri-tierTechnologyGree nGreenPackage Thickness (mm)PKG Size (mm)TechnologyMin. Package Thickness (mm)FC+WB typeFC+WB typeFC+WBFC+ / 3 / 4 / 5 / ~20X20 WBFC+WBSCSPE utectic BumpLead free BumpWB typeFC+WB Technology Overview -- TechnologyTechnology ItemAvailable200720082009Cu WaferW/B package (um)90 Low-K65 LK65 ELK65 ELK45 ELK32 ELKIn-line (um)3030 Staggered (um)3535 Quad-tier (um)605045452020Pd platingPd platingCopper WirePlating Cu WireN/AN/APackage WLCSPBGA LaminateFlip Chip BGAT echnologyFine Pitch140120 SubstrateGreenBare Cu WireN/A25 umLeadfremePlatingSnCu / Matt Sn / SnBiPPF5-tier (um)3535 Tri-tier (um)Bump Pitch (um)Thickness (2L/4L, mm)Ball pitch (mm) ( SCSP/PiP ) Package mm LGA( mm Cap) mm LGA( mm Cap) mm LGA( mm Cap) mm LGA( mm Cap) CSP( Cap) CSP( Cap) CSP( Cap) CSP( Cap) SCSP7 Chips9 Chips9 Chips9 ChipsHybrid PkgFC+WB (Lead Free)FC+WB (Green)FC+WB (Green)FC+WB (Green)E

ASEK 2007 Roadmap Overview. ASEK PKG Roadmap update. SIP / PiP / POP Technology Roadmap Leadless QFN Technology Roadmap Low K / Fine Pitch Wire Bond Technology Roadmap.

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