Transcription of ASE Technology Roadmap - asetwn.com.tw
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ASE Technology Roadmap - asetwn.com.tw
ASE Technology RoadmapASE Technology RoadmapPresented by The Advanced Semiconductor Engineering GroupDec. 01. 2006 ASEK 2007 Roadmap PKG Roadmap update. SIP / PiP / POP Technology Roadmap Leadless QFN Technology Roadmap Low K / Fine Pitch Wire Bond Technology Technology Overview -- SiPPackage ItemAvailable200720082009 Package Thickness (mm)(2/3/4 die stacked) / / / / / / / of Die99 Hybrid (WB+FC) Package Height (mm) ~20X2010X10~20X20 Max. Package Size (mm)27x2721x21 Wire Bond TechnologyTri-tierTri-tierTechnologyGree nGreenPackage Thickness (mm)PKG Size (mm)TechnologyMin. Package Thickness (mm)FC+WB typeFC+WB typeFC+WBFC+ / 3 / 4 / 5 / ~20X20 WBFC+WBSCSPE utectic BumpLead free BumpWB typeFC+WB Technology Overview -- TechnologyTechnology ItemAvailable200720082009Cu WaferW/B package (um)90 Low-K65 LK65 ELK65 ELK45 ELK32 ELKIn-line (um)3030 Staggered (um)3535 Quad-tier (um)605045452020Pd platingPd platingCopper WirePlating Cu WireN/AN/APackage WLCSPBGA LaminateFlip Chip BGAT echnologyFine Pitch140120 SubstrateGreenBare Cu WireN/A25 umL
ASE Technology Roadmap Presented by The Advanced Semiconductor Engineering Group Dec. 01. 2006
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