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ASSOCIATION CONNECTING ELECTRONICS …
ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES IPC-4761 Design Guidefor Protectionof Printed BoardVia StructuresDeveloped by the Via Protection Task Group (D-33d)of the Rigid Printed Board Committee (D-30) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1219 Tel 847 847 Contents1 and 12 APPLICABLE .. 13 PWB FABRICATION AND of Via Fabrication or Plug Separation from Plated HoleWall .. Process Term Reliability 44 MATERIALS/DESIGN Use of Materials for (Organic) Non-imageable .. for Tented/Covered Via Structures .. and Specification and 65 VIA PROTECTION DEFINITIONS AND Via (Type I Via).. and Covered Via (Type II Via).. Via (Type III Via).. and Covered Via (Type IV Via).. Via (Type V Via).
ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES® IPC-4761 Design Guide for Protection of Printed Board Via Structures Developed by …
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