Transcription of ASSOCIATION CONNECTING ELECTRONICS …
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ASSOCIATION CONNECTING ELECTRONICS …
IPC-7525 AStencil design GuidelinesDeveloped by the stencil design Task Group (5-21e) of the Assemblyand Joining Processes Committee (5-20) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1249 Tel 847 847 :IPC-7525 - May 2000 ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES Table of and Definitions .. *Aperture .. *Aspect Ratio .. *Area Ratio .. Paste Transfer Head .. Factor .. BGA/Chip Scale Package (CSP) .. *Fine-Pitch Technology (FPT) .. *Intrusive Soldering .. *Land .. *Overprinting .. *Pad .. *Squeegee .. BGA .. * stencil .. stencil .. *Surface-Mount Technology (SMT) .. *Through-Hole Technology (THT).
IPC-7525A Stencil Design Guidelines Developed by the Stencil Design Task Group (5-21e) of the Assembly and Joining Processes Committee (5-20) of IPC
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