Transcription of ASSOCIATION CONNECTING ELECTRONICS …
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ASSOCIATION CONNECTING ELECTRONICS …
IPC/JEDEC-9704 Printed Wiring BoardStrain Gage Test GuidelineDeveloped by the JEDEC Reliability Test Methods for Packaged DevicesCommittee ( ) and the SMT Attachment Reliability Test MethodsTask Group (6-10d) of the Product Reliability Committee (6-10) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1219 Tel 847 847 CONNECTINGELECTRONICS INDUSTRIES Table of .. and Definitions .. 22 APPLICABLE .. Publications .. 23 GENERAL .. and Gage .. Attachment .. Calibration .. Simulation .. Package Test .. 114 DATA ANALYSIS AND Frequency .. Gage Test Report 12 APPENDIX ASTRAIN 14 APPENDIX BREFERENCE FOR RATE 16 APPENDIX CICT DESIGN 18 APPENDIX 19 FiguresFigure 1-1 Lifted 1 Figure 3-1 Board Assembly Strain Measurement.
Printed Wiring Board Strain Gage Test Guideline 1 SCOPE This document describes specific guidelines for strain gage testing for Printed Wiring Board (PWB) assemblies in …
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