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ASSOCIATION CONNECTING ELECTRONICS …

IPC/ jedec J-STD-020 CMoisture/ReflowSensitivity Classificationfor NonhermeticSolid State SurfaceMount DevicesA joint standard developed by the IPC Plastic Chip Carrier Cracking TaskGroup (B-10a) and the jedec Committee on Reliability TestMethods for Packaged DevicesUsers of this standard are encouraged to participate in thedevelopment of future :JEDECS olid State Technology Association2500 Wilson BoulevardArlington, VA 22201-3834 Phone (703) 907-7500 Fax (703) 907-7501 IPC2215 Sanders RoadNorthbrook, IL 60062-6135 Phone (847) 509-9700 Fax (847) 509-9798 Supersedes:IPC/ jedec J-STD-020B -July 2002 IPC/ jedec J-STD-020A -April 1999J-STD-020 - October 1996 jedec JESD22-A112 IPC-SM-786A - January 1995 IPC-SM-786 - December 1990 ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES Table of.

IPC/JEDEC J-STD-020C Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices A joint standard developed by the IPC Plastic Chip Carrier Cracking Task

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  Sensitivity, Electronic, Classification, Association, Flowers, Jedec, Connecting, Association connecting electronics, Moisture, Nonhermetic, C200, Ipc jedec j std 020c moisture reflow sensitivity classification for nonhermetic

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