Transcription of ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES …
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ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES IPC-4761 Design Guidefor Protectionof Printed BoardVia StructuresDeveloped by the Via Protection Task Group (D-33d)of the Rigid Printed Board Committee (D-30) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1219 Tel 847 847 Contents1 and 12 APPLICABLE .. 13 PWB FABRICATION AND of Via Fabrication or Plug Separation from Plated HoleWall .. Process Term Reliability 44 MATERIALS/DESIGN Use of Materials for (Organic) Non-imageable .. for Tented/Covered Via Structures .. and Specification and 65 VIA PROTECTION DEFINITIONS AND Via (Type I Via).
to detailing some of the advantages of via protection, pro-duction and material issues are given to aid the user in evalu-ating the benefits and concerns for each type of protection. 1.2 Terms and Definitions The definition of all terms used herein shall be as specified in IPC-T-50 and as defined below.
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