Transcription of AXIC APPLICATION REPORT - Plasma Cleaning
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AXIC APPLICATION REPORT - Plasma Cleaning
axic APPLICATION REPORT PHOTORESIST STRIPPING 10 by Jozef Brcka, AXJC, Santa Clara, CaliftJmia T HERE ARE MANY applications OF Plasma PROCESSES to organic materials. These include surface property modifications to improve wetting, dyeing, printing, and adhesion properties of polymeric materials, as well as, Plasma ashing to remove "organic smear" that results from mechanical drilling of printed circuit boards [ 1]. The original and still most widely applied use of Plasma processing to the electronics industry is photoresist stripping, which is the removal of polymeric photoresists following lithography, etching and deposition processes m semiconductor manufacturing. A competing photoresist stripping technology is wet stripping, which is the removal of photoresists with chemical solutions. However, there are many advantages to dry, Plasma stripping over wet chemical stripping as outlined in Table 1.
AXIC APPLICATION REPORT NO. 10 means by which this can be achieved. Sensing of CO plasma emissions or even simple observation of plasma discharge color …
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