Transcription of BEOL Interconnect Innovations for Improving Performance
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BEOL Interconnect Innovations for Improving Performance
BEOL Interconnect Innovations for Improving Performance Paul Besser, PhD Formerly Senior Technology Director at Lam Research Currently Director of Emerging Technologies at ARM February 23, 2017 Paul Besser, NCCAVS Symposium in San Jose, CA Acknowledgements Lam Research Hui-Jung Wu, Justin Jiang, Kaushik Chattopadhyay, Lee Brogan, Natalia Doubina, Nagraj Shankar, Cheng-Kai Li, and Larry Zhao imec Houman Zahedmanesh, Kristof Croes, Ivan Ciofi GLOBALFOUNDRIES Todd Ryan ARM Saurabh Sinha, Brian Cline, Greg Yeric February 23, 2017 Paul Besser, NCCAVS Symposium in San Jose, CA 2 Market Needs Drive Requirements and Technology Innovations 3 Power, Performance , cost/area (PPA) are driving our industry Customers demand the highest performing processors Performance Power Cost/Area Slide from Paul Besser, Semicon Korea 2014 A4 A5 A6 A7 A8 A9 32nm HKMG 28nm HKMG 20nm HKMG 14nm FinFET February 23, 2017 Paul Besser, NCCAVS Symposium in San Jose, CA Innovations in Silicon Manufacturing February 23, 2017 Paul Besser, NCCAVS Symposium in San Jose, CA 4 11 Elements +4 Elements +45 Elements (Potential) New materials enable innovation by Improving Performance , Enabling dimensional scaling, and Improving reliability Slide from Paul Besser, Semicon Korea 2014 Eless Co via prefill Co metal Air gap at tight pitch New Cu BM Eless Ni MOL and BEOL Material
Feb 23, 2017 · Ultra Low-K ULK Cap Cu Contact Dual Si 2 Porous LK Cu Alloys ELD Cu TiSi 2 ALD W NiPtSi Technology Node (nm) 350 250 180/130 90 65 /45 45/32 28/20 14 10/7 nm FTEOS ILD Cu Barriers Cu wiring CVD W MOCVD TiN CoSI 2 Eless Co via prefill Co Metal Air gap at tight pitch New Cu BM Eless Ni MIS TiSi x Air Gap Selective Metal caps ...
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