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Chapter 1.10 - Miscellaneous Etchants

Marvell NanoLab Member login Lab Manual Contents MercuryWeb Berkeley Microlab Chapter Miscellaneous Etchants Table of Contents Aluminum Etchant Type A (Transene Co., Inc.) for VLSI Others Antimony Etchant Aqua Regia Bismuth Etchant Brass Cadmium Sulfide Etchant (CdS) Telluride (CdTe) Chromium Etchant Chromium/Nichrome Etchant Cobalt Columbium Copper Dislocation Etchants Sirtl Secco Wright-Jenkins ASTM Gallium Arsenide Phosphide Germanium Etchant (and Germanium-Silicon) Gold Indium Antimonide Phosphide Tin Oxide (ITO) Iron Etchant Kovar Lead Lucite Magnesium Magnesium Fluoride Mercury Molybdenum (Moly) Monel Nichrome Nichrome Etchant Nickel Nickel Etchant Nickel Oxides Niobium P-Etchant Palladium Miscellaneous Etchants Chapter Picein Wax Piranha Platinum Polish Fairchild s Magic Polish Polysilicon Etchant (see also Silicon Etchant) Preferential Etch (see Dislocation Etchant Wright Jenkins Etchant) Rhodium Ruthenium Silicon Polycrystalline Silicon (Bell Labs) Big Batch Silicon Etch (staff only) Single-Crystal (Sensors)

For VLSI aluminum etching, there is available a pre-mixed phosphoric/acetic acid mixture. ... Etch rate ~ 2000 Å/min. 16 parts phosphoric acid . 2 parts DI water . 1 part acetic acid . 1 part nitric acid . Aluminum Etchants - Others These will not etch gold, etc. Phosphoric acid at 60ºC ... 1 part conc. HF or 50 g CrO: 3: in 100 ml H: 2: O ...

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