Transcription of CHAPTER 12: PRINTED CIRCUIT BOARD (PCB) DESIGN …
{{id}} {{{paragraph}}}
PRINTER CIRCUIT BOARD ISSUES CHAPTER 12: PRINTED CIRCUIT BOARD (PCB) DESIGN ISSUES INTRODUCTION SECTION : PARTITIONING SECTION : TRACES RESISTANCE OF CONDUCTORS VOLTAGE DROP IN SIGNAL LEADS "KELVIN FEEDBACK" SIGNAL RETURN CURRENTS GROUND NOISE AND GROUND LOOPS GROUND ISOLATION TECHNIQUES STATIC PCB EFFECTS SAMPLE MINIDIP AND SOIC OP AMP PCB GUARD LAYOUTS DYNAMIC PCB EFFECTS INDUCTANCE STRAY INDUCTANCE MUTUAL INDUCTANCE PARASITIC EFFECTS IN INDUCTORS Q OR "QUALITY FACTORS" DON'T OVERLOOK ANYTHING STRAY CAPACITANCE CAPACITATIVE NOISE AND FARADAY SHIELDS BUFFERING ADCs AGAINST LOGIC NOISE HIGH CIRCUIT IMPEDANCES ARE SUSCEPTIBLE TO NOISE PICKUP SKIN
SUMMARY: GROUNDING MIXED SIGNAL DEVICES WITH HIGH DIGITAL CURRENTS IN A MULTICARD SYSTEM 12.68 GROUNDING DSPs WITH INTERNAL PHASE-LOCKED LOOPS 12.69 ... board's performance may be compromised. It is therefore well worthwhile to allocate extra PCB connector pins so that there are many ground connections (perhaps 30% to ...
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
{{id}} {{{paragraph}}}