Transcription of CHAPTER 12: PRINTED CIRCUIT BOARD (PCB) DESIGN ISSUES
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CHAPTER 12: PRINTED CIRCUIT BOARD (PCB) DESIGN ISSUES
PRINTER CIRCUIT BOARD ISSUES CHAPTER 12: PRINTED CIRCUIT BOARD (PCB) DESIGN ISSUES INTRODUCTION SECTION : PARTITIONING SECTION : TRACES RESISTANCE OF CONDUCTORS VOLTAGE DROP IN SIGNAL LEADS "KELVIN feedback " SIGNAL RETURN CURRENTS GROUND NOISE AND GROUND LOOPS GROUND ISOLATION TECHNIQUES STATIC PCB EFFECTS SAMPLE MINIDIP AND SOIC OP AMP PCB GUARD LAYOUTS DYNAMIC PCB EFFECTS INDUCTANCE STRAY INDUCTANCE MUTUAL INDUCTANCE PARASITIC EFFECTS IN INDUCTORS Q OR "QUALITY FACTORS" DON'T OVERLOOK ANYTHING STRAY CAPACITANCE CAPACITATIVE NOISE AND FARADAY SHIELDS BUFFERING ADCs AGAINST LOGIC NOISE HIGH CIRCUIT IMPEDANCES ARE SUSCEPTIBLE TO NOISE PICKUP SKIN
voltage drop in signal leads—"kelvin feedback" 12.7 signal return currents 12.7 ground noise and ground loops 12.9 ground isolation techniques 12.11 static pcb effects 12.15 sample minidip and soic op amp pcb guard layouts 12.17 dynamic pcb effects 12.19 inductance 12.21 stray inductance 12.21 mutual inductance 12.22
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