Transcription of CHAPTER 12: PRINTED CIRCUIT BOARD (PCB) DESIGN ISSUES
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PRINTER CIRCUIT BOARD ISSUES CHAPTER 12: PRINTED CIRCUIT BOARD (PCB) DESIGN ISSUES INTRODUCTION SECTION : PARTITIONING SECTION : TRACES RESISTANCE OF CONDUCTORS VOLTAGE DROP IN SIGNAL LEADS "KELVIN FEEDBACK" SIGNAL RETURN CURRENTS GROUND NOISE AND GROUND LOOPS GROUND ISOLATION TECHNIQUES STATIC PCB EFFECTS SAMPLE MINIDIP AND SOIC OP AMP PCB GUARD LAYOUTS DYNAMIC PCB EFFECTS INDUCTANCE STRAY INDUCTANCE MU
design of the layout of printed circuit boards can be as demanding as the design of the electrical circuit. Most modern systems consist of multilayer boards of anywhere up to eight layers (or sometimes even more). Traditionally, components were mounted on the top layer in holes which extended through all layers.
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