Transcription of Chapter A: Wire Bonding 2 Level 2. Conclusions and guideline
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Chapter A: Wire Bonding 2 Level 2. Conclusions and guideline
Chapter A: wire Bonding 2 Level 2. Conclusions and guideline Wirebonding techniques There are two basic wirebonding techniques that are used in thermocompression (T/C), thermosonic (T/S)or ultrasonic (U/S) Bonding process: ball Bonding and wedge Bonding . Approximately 93% of allsemiconductor packages are manufactured using ball Bonding method, while wedge Bonding is used toproduce about 5% of all assembled packages. Bonding In this technique, wire is passed through a hollow capillary, and anelectronic-flame-off system (EFO) is used to melt a small portionof the wire extending beneath the capillary.
Gold and aluminum are the commonly used wire materials, in addition, copper and silver have also been used. Bonding these wires to different pad materials produces different metallurgical systems. 2.2.1 Wires usually used in wirebonding Gold wire Gold wire is used extensively for thermocompression bonding and thermosonic bonding. In producing the
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