Transcription of CMOS image sensor fabrication technologies Pixel design ...
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LectureNotes5 CMOSI mageSensor DeviceandFabrication cmos imagesensor fabricationtechnologies Pixeldesignandlayout Imagingperformanceenhancementtechniques Technologyscaling,industrytrends Microlens Color lterarrayEE392B:DeviceandFabrication5-1 ModernCMOSD eviceStructureEE392B:DeviceandFabricatio n5-2 ImagingIs Di erentfromDigitalLogicFeaturesDigitalLogi cImagingSilicideImprovescontactresistanc eAbsorbslight{ low photosensitivityIncreasedjunctionleakage STIE nablestighterdesignrulesLeadsto largerdark currentduetodefectsfromstressShallow junctionReducesshort-channele ectReducesquantume ciencyformediumto longwavelengthlightLower power supplyvoltageReducespower consumption,enablesdevicescalingReducesh eadroomfor signalswingLower thresholdvoltageImprovesdrivecurrentIncr easessubthresholdleakageThingateoxideEna blesdevicescalingtoshorterchannellengthI ncreasesgateleakageMultiplelevelsof interconnectImproveswire-abilityIncrease sdistancefrommicrolensorcolor lterto photodetectorEE392B:DeviceandFabrication 5-3 BaselineModi cationsof CM}
Standard CMOS logic transistors to reduce power consumption and attain high circuit speed Similar strategy as DRAM Separate \array" transistors, and \support circuit" transistors EE 392B: Device and Fabrication 5-25. Pixel Layout and Pixel Size Pixel size mostly determined by …
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