Transcription of Data sheet acquired from Harris Semiconductor
{{id}} {{{paragraph}}}
Example: bankruptcy
Data sheet acquired from Harris Semiconductor
Data sheet acquired from Harris Semiconductor SCHS023D Revised April 2005. The CD4013B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes). 15. * 10. 5. Copyright 2005, Texas Instruments Incorporated 1. 2. 3. 4. PACKAGE OPTION addendum . 10-Jun-2014. PACKAGING INFORMATION. Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp ( C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5). 89267 AKB3T OBSOLETE CFP WR 14 TBD Call TI Call TI -55 to 125. CD4013BE ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU N / A for Pkg Type -55 to 125 CD4013BE. (RoHS). CD4013 BEE4 ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU N / A for Pkg Type -55 to 125 CD4013BE.
PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 Addendum-Page 3 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
Loading..
Tags:
Information
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document: