Transcription of Device Reliability Report First Half 2021
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Device Reliability Report First Half 2021
Device Reliability ReportFirst Half 2021UG116 ( ) November 10, 2021 Xilinx is creating an environment where employees, customers, andpartners feel welcome and included. To that end, we re removing non-inclusive language from our products and related collateral. We velaunched an internal initiative to remove language that could excludepeople or reinforce historical biases, including terms embedded in oursoftware and IPs. You may still find examples of non-inclusivelanguage in our older products as we work to make these changes andalign with evolving industry standards. Follow this link for HistoryThe following table shows the revision history for this Version 1: The Reliability ProgramIn Table 7, added 7 nm and removed 130 nm processtechnology. In ESD and Latch-up Summary, updatedspecifications and removed list of devices.
Changed many tables to show test data for the first half of 2016. Added new product and package reliability data for XCVU440, XCVU190, XCVU125, XCVU095, and XCKU115 with respective packages of FFV1517, FFV1924, and FFV2104, FLV1517, FLV1924, and FLV2104 , FLG2104, FLG2377, and FLG2892. Removed the reliability data for these obsolete devices
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