Transcription of Digital-Pixel Focal Plane Array Technology
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Digital-Pixel Focal Plane Array Technology Kenneth I. Schultz, Michael W. Kelly, Justin J. Baker, Megan H. Blackwell, Matthew G. Brown, Curtis B. Colonero, Christopher L. David, Brian M. Tyrrell, and James R. Wey Lincoln Laboratory has developed a digital- pixel Focal Plane Array with per-pixel, 16-bit full Many emerging thermal infrared (IR). sensing applications simultaneously demand high sensitivity, large dynamic dynamic range, analog-to-digital conversion, and range, large pixel count, and operation at real-time digital image processing capability. The fast data rates. Among these applications are day/night Technology leverages modern semiconductor persistent surveillance, border patrol and protection, aer- ial search and rescue, and environmental remote sensing. processes to achieve low-power, high- Such applications typically require sensor systems capable component-density designs. Infrared sensors of high-quality, large-pixel-count images; furthermore, based on this innovative Technology are enabling in many cases, the images must be processed rapidly to extract time-critical information.
38 LINCOLN LABORATORY JOURNAL VOLUME 20, NUMBER 2, 2014 DIGITAL-PIXEL FOCAL PLANE ARRAY TECHNOLOGY allowable voltage across the capacitor. A simplified ROIC unit cell (pixel) circuit diagram and example ROIC lay-
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