Dye and Pry of BGA Solder Joints - Cascade Engineering

Dye and Pry of BGA Solder Engineering GroupCascade Engineering Services, 185th Ave NE Redmond WA 98052(425) 895-8617 x 564 CPU Failure InvestigationEquipment Used Dye and Pry TechniqueConclusions Majority of failures (cracks from mechanical bend overstress test) observed at Solder -Chip interface Summary of % area cracked at each interface in the area of interestOptical Image with Extended Focal Imaging StitchingSol der- Chi pOkSol der- PCBOkSol der- PCBOkSol der- PCBOkSol der- Chi p~5%Sol der- Chi pOkSol der- PCBOkSol der- PCBOkSol der- PCBOkSol der- PCBOkSol der- Chi p~10%Sol der- PCBOkSol der- PCBOkSol der- PCBOkSol der- Chi p~20%Sol der- PCBOkChipPCBDRAM Failure InvestigationEquipment Used Dye and Pry TechniqueConclusions Interfacial fracture / cracks observed at two locations: Solder -CU-PCB Interface and Solder Chip interface Summary of % area cracked at each interface in the area of interestChipPCBSol der -ch ip~80%Sol der -PCB~50%Sol der -ch ip~5%Sol der -ch ip~50%Sol der -PCB~40%Sol der -PCB~50%Sol der -ch ip~50%Sol der -ch ip~15%Sol der -Chi p~10%Sol der -ch ipDRAM Failure Investigation (Continued)Equipment Used Dye and Pry TechniqueChipPCBI mages show the fracture surface aft

DRAM Failure Investigation Equipment Used • Dye and Pry Technique Conclusions • Interfacial fracture / cracks observed at two locations: Solder-CU-PCB Interface

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  Joint, Solder, And pry of bga solder joints

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