Transcription of Electronic Packaging Technologies - Carleton University
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Electronic Packaging Technologies1 Electronic Packaging Electronic Packaging TechnologiesTechnologiesSergio Lopez-Buedo, Eduardo BoemoUniversidad Autonoma de Madride-mail: Packaging Technologies2 Introduction to Electronic PackagingIntroduction to Electronic Packaging Electronic Packaging is a multi-disciplinary subject Mechanical, Electrical and Industrial Engineering, Chemistry, Physics and even Marketing Electronic Packaging :Housing and interconnection of integrated circuits to form Electronic systems Electronic Packagingmust provide Circuit support and protection Heat dissipation Signal distribution Manufacturability and serviceability Power distributionElectronic Packaging Technologies3 Issues in Electronic PackagingIssues in Electronic PackagingMechanical analysis and testingReliability, performance, cost, market need/timing, manufacturability, analysis and testingElectrical analysis and testingChemistry,Physics, Mat.
application. Bonded one at a time, the wire is fed through a ceramic capillary. With a good ... – Epoxy Die Attach: Epoxy die attach is the most commonly used ... that stencils electrically conductive adhesive over an underbump metallization placed over the …
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