Transcription of Electronic Packaging Technologies - Carleton University
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Electronic Packaging Technologies - Carleton University
Electronic Packaging Technologies1 Electronic Packaging Electronic Packaging TechnologiesTechnologiesSergio Lopez-Buedo, Eduardo BoemoUniversidad Autonoma de Madride-mail: Packaging Technologies2 Introduction to Electronic PackagingIntroduction to Electronic Packaging Electronic Packaging is a multi-disciplinary subject Mechanical, Electrical and Industrial Engineering, Chemistry, Physics and even Marketing Electronic Packaging :Housing and interconnection of integrated circuits to form Electronic systems Electronic Packagingmust provide Circuit support and protection Heat dissipation Signal distribution Manufacturability and serviceability Power distributionElectronic Packaging Technologies3 Issues in Electronic PackagingIssues in Electronic PackagingMechanical analysis and testingReliability, performance, cost, market need/timing, manufacturability, analysis and testingElectrical analysis and testingChemistry,Physics, Mat.
Chip Scale Packages (CSP) • Chip Scale Package, or CSP, based on IPC/JEDEC J-STD-012 definition, is a single-die, direct surface mountable package with an area of no more than 1.2 times the original die area Electronic Packaging Technologies 12 CSP Benefits and Drawbacks • CSP is not a new mounting technology, is an evolution of SMD
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