Transcription of ELECTRONICS INDUSTRIES Design Guide for the …
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IPC-2251 Design Guide for thePackaging of high SpeedElectronic CircuitsDeveloped by the IPC-2251 Task Group (D-21a) of the high speed / high Frequency Committee (D-20) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC2215 Sanders RoadNorthbrook, Illinois60062-6135 Tel 847 847 :IPC-D-317A - January 1995 IPC-D-317 - April 1990 ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES Table of .. , Terms and Definitions .. and Definitions .. 62 APPLICABLE Making Process .. Electrical/Mechanical Constraints .. Integrity Design Constraints .. Electrical/Mechanical Requirements .. packaging .. Management .. Mounting .. Considerations .. Distribution .. Versus Transmission LineEnvironment .. Time .. Impedance .. Loading Effects .. 124 MECHANICAL Board.
Design Guide for the Packaging of High Speed Electronic Circuits 1 GENERAL 1.1 Purpose The object of this document is to provide guidelines for the design of high-speed circuitry. The sub-
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