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ELECTRONICS INDUSTRIES Design Guide for the …
IPC-2251 Design Guide for thePackaging of high SpeedElectronic CircuitsDeveloped by the IPC-2251 Task Group (D-21a) of the high speed / high Frequency Committee (D-20) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC2215 Sanders RoadNorthbrook, Illinois60062-6135 Tel 847 847 :IPC-D-317A - January 1995 IPC-D-317 - April 1990 ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES Table of .. , Terms and Definitions .. and Definitions .. 62 APPLICABLE Making Process .. Electrical/Mechanical Constraints .. Integrity Design Constraints .. Electrical/Mechanical Requirements .. packaging .. Management .. Mounting .. Considerations .. Distribution .. Versus Transmission LineEnvironment .. Time .. Impedance .. Loading Effects .. 124 MECHANICAL Board.
IPC-2251 Design Guide for the Packaging of High Speed Electronic Circuits Developed by the IPC-2251 Task Group (D-21a) of the High Speed/ High Frequency Committee (D-20) of IPC
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