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ELECTRONICS INDUSTRIES Performance Test Methods and ...

IPC-9701 APerformance TestMethods and QualificationRequirements for SurfaceMount Solder AttachmentsDeveloped by the SMT Attachment Reliability Test Methods Task Group(6-10d) of the Product and Reliability Committee (6-10) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1219 Tel 847 847 :IPC-9701 - January 2002 ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES Table of .. Classification .. of Terms .. 12 APPLICABLE .. Industry Standards .. Tin Research Institute.

2.4.8 Peel Strength, Metal Foil 2.4.21.1 Bond Strength, Surface Mount Land (Perpen-dicular Pull Method) 2.4.22 Bow and Twist 2.4.36 Rework Simulation, Plated-Through Holes 2.4.41.2 Coefficient of Thermal Expansion, Strain Gage Method 2.5.7 Dielectric Withstanding Voltage, Printed Wiring Material 2.6.5 Physical (Mechanical) Shock, Multilayer ...

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