Transcription of Etch rates for micromachining processing-part II ...
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Etch rates for micromachining processing-part II ...
Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is JOURNAL. presented OF. to ensure timely dissemination of scholarly MICROELECTROMECHANICAL SYSTEMS, and technical VOL. 12, Copyright2003. 6, DECEMBER and all rights therein are retained by authors or by other copyright holders. 761 All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. etch rates for micromachining processing Part II. Kirt R. Williams, Senior Member, IEEE, Kishan Gupta, Student Member, IEEE, and Matthew Wasilik Abstract Samples of 53 materials that are used or potentially be used in future fabrication of microelectromechanical systems can be used or in the fabrication of microelectromechanical (MEMS) and integrated circuits (ICs) (approximately 50 etch systems and integrated circuits were prepared: single-crystal rates measured in the earlier paper have been included in this silicon with two doping levels, polycrystalline silicon with two doping levels, polycrystalli)
the etch rates of other materials that will be exposed to the etch, such as masking films and underlying layers, enables an etch process to be chosen for good selectivity (high ratio of etch rate of the target material to etch rate of the other material)—if one exists. While several large literature-review compilations
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