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Application ReportSZZA024 - January 20011 Evaluation of Nickel/Palladium-Finished ICsWith Lead-Free solder AlloysDouglas Romm, Bernhard Lange, and Donald AbbottStandard Linear & LogicABSTRACTA nickel/palladium (Ni/Pd) lead finish for integrated circuits (IC) was introduced in 1989. In1998, solderability test results were published on Ni/Pd-finished components using aSn/Ag/Cu/Sb lead-free (Pb-free) solder paste and printed wiring board (PWB) pads coatedwith organic solderability preservative (OSP). Since then, a number of other Pb-free solderalloys have been evaluation shows soldering and reliability performance of Ni/Pd-finished componentswith the leading Pb-free solder alloys now being considered by the electronics industry. TheICs tested were 20-pin small-outline integrated circuit (SOIC) and 56-pin shrink small-outlinepackage (SSOP) gull-wing leaded devices finished with four-layer Ni/Pd. The solder alloyswere Sn/Pb/Ag (control), Sn/Ag/Cu, Sn/Bi, Sn/Ag/Cu/Sb, Sn/Zn/Bi, and Sn/Zn.
SZZA024 Evaluation of Nickel/Palladium-Finished ICs With Lead-Free Solder Alloys 5 Sn/Pb/Ag solder alloy was the control paste. The Sn/Ag/Cu alloy was chosen because this alloy
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