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High-Speed Layout Guidelines for Signal Conditioners and ...

1 SLLA414 August2018 SubmitDocumentationFeedbackCopyright 2018,TexasInstrumentsIncorporatedHigh-Sp eedLayoutGuidelinesfor SignalConditionersand USBHubsApplicationReportSLLA414 August2018 High-SpeedLayoutGuidelinesfor SignalConditionersand moderninterfacefrequenciesscalehigher,ca remustbe takenin the printedcircuitboard(PCB)layoutphaseof a designto ensurea highspeedlayoutsguidelinesrelatingto USB,USBHubs,HDMI,DisplayPort,PCIeand of Figures1 Intervs. IntraPair CapacitorAcrossa AC Via Via SpacingNextto SpacingNextto Clockor a of August2018 SubmitDocumentationFeedbackCopyright 2018,TexasInstrumentsIncorporatedHigh-Sp eedLayoutGuidelinesfor SignalConditionersand USBHubs2 PossibleBoardStack-upon a a trademarksare the propertyof Augu

coupling capacitors, inter-pair skew, intra-pair skew and trace impedance. Below are standard values for the different high standards. The following values and suppose to be guidelines are not always exact values. 2.1 USB 2.0 Parameter Value Frequency Low speed: 750 KHz (1.5 Mbps) Full Speed: 6 MHz (12 Mbps) High Speed: 240 MHz (480 Mbps)

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